DocumentCode :
838036
Title :
Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes
Author :
Li, Yi ; Moon, Kyoung-Sik ; Whitman, Andrew ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA
Volume :
29
Issue :
4
fYear :
2006
Firstpage :
758
Lastpage :
763
Abstract :
To improve the electrical properties of electrically conductive adhesives (ECAs), different types of aldehydes, salicylaldehyde and transcinnamaldehyde, were introduced into ECA formulations. During the curing process, the aldehydes acted as a reducing agent and reduced metal oxide in ECAs. At the same time, aldehydes could consume ambient oxygen and prevent the oxidation of the metal fillers in the ECA. The oxidation product of aldehydes, carboxylic acids with shorter molecular chains, could partially replace or remove the long chain stearic acid (C 18) surfactant on the lubricated Ag flakes and enhance the electrons tunneling between the Ag flakes in the ECAs. As such, the multiple effects of aldehydes in ECAs improved the conductivity significantly. Dynamic mechanical analysis and thermomechanical analysis studies indicated the improved performance for mechanical and physical properties of ECAs as well
Keywords :
conductive adhesives; curing; electric properties; mechanical properties; organic compounds; oxidation; surfactants; aldehydes; carboxylic acids; curing process; dynamic mechanical analysis; electrical properties; electrically conductive adhesives; electronic packaging; electrons tunneling; improved conductivity; mechanical properties; oxidation product; reducing agent; salicylaldehyde; thermomechanical analysis; transcinnamaldehyde; Chip scale packaging; Conductive adhesives; Conductivity; Electronics packaging; Electrons; Independent component analysis; Mechanical factors; Oxidation; Performance analysis; Surface-mount technology; in-situ replacement; Electrically conductive adhesives (ECAs); electrical properties improvement; electronic packaging;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2006.885940
Filename :
4016228
Link To Document :
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