DocumentCode :
838103
Title :
Thermally Induced Mechanical Degradation of Contact Spots in Aluminum Interfaces
Author :
Ruppert, Christopher ; Runde, Magne
Author_Institution :
Dept. of Electricity & Semicond., Eur. Patent Office, Den Haag
Volume :
29
Issue :
4
fYear :
2006
Firstpage :
833
Lastpage :
840
Abstract :
Deterioration of an electric contact is closely related to phenomena occurring in the microscopic contact spots in the contact interface. Contact spots in idealized aluminum-aluminum contact interfaces, that have passed heavy alternating currents, have been carefully examined by scanning electron microscopy and metallographic imaging techniques. Small cracks are observed in the contact spot regions, and have to a great extent impaired the current-carrying ability of the area. The temperature in the contact spots cycles with twice the power frequency, and in heavily stressed contacts the maximum temperature reaches several hundred degrees centigrade. The associated local thermal expansion and contraction in and around the immediate vicinity of the contact spot generates cyclic mechanical forces of substantial magnitudes. Indications that this repetitive stress causes the observed cracks are found. It is suggested that the resistance increase observed in practical aluminum connectors being subjected to short-circuit currents can have a similar origin
Keywords :
aluminium; contact resistance; electrical contacts; metallography; scanning electron microscopy; thermal stress cracking; Al; contact interface; current-carrying ability; cyclic mechanical forces; electric contact; metallographic imaging; microscopic contact spots; repetitive stress; scanning electron microscopy; short-circuit currents; thermal contraction; thermal expansion; thermally induced mechanical degradation; Aluminum; Connectors; Contacts; Frequency; Scanning electron microscopy; Temperature; Thermal degradation; Thermal expansion; Thermal force; Thermal stresses; Aging; aluminum; contact resistance; contacts;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2006.885964
Filename :
4016234
Link To Document :
بازگشت