Power Handling Capability of Substrate Integrated Waveguide Interconnects and Related Transmission Line Systems

As a novel interconnect and planar transmission line structure, the substrate integrated waveguide (SIW) is investigated in terms of its power handling capabilities (PHCs) including average and peak power handling capabilities. A heat transfer analysis based on ohmic and dielectric attenuation of SIW has been used to calculate the average power handling capability (APHC) while the maximum E-field derivation method has been selected to determine the peak power handling capability (PPHC). Results from the present investigations have shed light on some basic properties of SIW interconnects and related transmission line systems in a high-power operating environment and also can be used to analyze some application-oriented structures such as SIW bends. It is believed from the conclusions that an SIW interconnect can handle medium average power with extremely high peak power over microwave and millimeter-wave frequency bands.