• DocumentCode
    838313
  • Title

    The development of silver-based cadmium-free contact materials

  • Author

    Wingert, Philip C. ; Leung, Chi-Hung

  • Author_Institution
    Adv. Metall. Inc., Reidsville, NC, USA
  • Volume
    12
  • Issue
    1
  • fYear
    1989
  • fDate
    3/1/1989 12:00:00 AM
  • Firstpage
    16
  • Lastpage
    20
  • Abstract
    A systematic procedure for developing improved contact materials is presented. Utilization of the procedure is described in detail for the development of an improved silver-based cadmium-free contact material. The procedure involves electrical testing first of materials containing silver and major percentages of different oxide components. Based on these test results, the best major component is selected. A second test sequence is then conducted to evaluate the influence of minor percentages of different oxide additives on the performance of materials having the previously selected base composition. After selecting several of the most promising minor additives a complete series of device tests is run. The final selection of the best material composition is made based on these device test results. The cadmium-free material developed using this procedure is shown to exhibit superior weld resistance and lower erosion weight loss relative to a good-high-density P/M (powder metallurgy) silver-cadmium-oxide material.<>
  • Keywords
    electrical contacts; materials testing; silver; Cd free contacts; base composition; contact materials; electrical testing; erosion weight loss; major component; material composition; materials optimisation; materials testing; minor additives; oxide additives; series of device tests; systematic procedure; test results; test sequence; weld resistance; Additives; Composite materials; Conducting materials; Conductivity; Contacts; Manufacturing; Materials testing; Microstructure; System testing; Welding;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.19007
  • Filename
    19007