• DocumentCode
    838510
  • Title

    Optimum computation of capacitance coefficients of multilevel interconnecting lines for advanced package

  • Author

    Ahmadouche, A. ; Chilo, J.

  • Author_Institution
    Lab. d´´Electromagn., Grenoble Univ., France
  • Volume
    12
  • Issue
    1
  • fYear
    1989
  • fDate
    3/1/1989 12:00:00 AM
  • Firstpage
    124
  • Lastpage
    129
  • Abstract
    A general procedure for computing the capacitance coefficients of multilevel interconnections in multilayered dielectric medium is given. The electromagnetic concept of total charge density is applied. It makes it possible to obtain integral equations between scalar potential and charge density distributions. These equations are solved by the method of moments technique. To optimize the computational algorithm, special consideration is given to the limitation of the dimensions of the dielectric interfaces. Simple criteria are introduced to divide the interfaces into an optimum number of elementary parts. Theoretical results thus obtained agree closely with the experimental results from test vehicles.<>
  • Keywords
    capacitance; packaging; printed circuit design; transmission line theory; advanced package; capacitance coefficients; charge density distributions; computational procedure optimisation; electromagnetic concept; experimental results; integral equations; method of moments; multilayered dielectric medium; multilevel interconnecting lines; multilevel interconnections; optimum number of elementary parts; scalar potential; total charge density; Capacitance; Computer interfaces; Dielectrics; Green´s function methods; Integral equations; Integrated circuit interconnections; Packaging; Space charge; Transmission line matrix methods; Vehicles;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.19026
  • Filename
    19026