• DocumentCode
    838901
  • Title

    Module placement with boundary constraints using B*-trees

  • Author

    Lin, J.-M. ; Yi, H.-E. ; Chang, Y.-W.

  • Author_Institution
    Dept. of Comput. & Inf. Sci., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • Volume
    149
  • Issue
    4
  • fYear
    2002
  • fDate
    8/1/2002 12:00:00 AM
  • Firstpage
    251
  • Lastpage
    256
  • Abstract
    The module placement problem is to determine the co-ordinates of logic modules in a chip such that no two modules overlap and some cost (e.g. silicon area, interconnection length, etc.) is optimised. To shorten connections between inputs and outputs and/or make related modules adjacent, it is desired to place some modules along the specific boundaries of a chip. To deal with such boundary constraints, we explore the feasibility conditions of a B*-tree with boundary constraints and develop a simulated annealing-based algorithm using B*-trees. Unlike most previous work, the proposed algorithm guarantees a feasible B*-tree with boundary constraints for each perturbation. Experimental results show that the algorithm can obtain a smaller silicon area than the most recent work based on sequence pairs
  • Keywords
    logic CAD; modules; simulated annealing; trees (mathematics); B*-tree; boundary constraints; interconnection length; logic module placement; silicon area; simulated annealing algorithm;
  • fLanguage
    English
  • Journal_Title
    Circuits, Devices and Systems, IEE Proceedings -
  • Publisher
    iet
  • ISSN
    1350-2409
  • Type

    jour

  • DOI
    10.1049/ip-cds:20020433
  • Filename
    1040126