• DocumentCode
    839033
  • Title

    Negative Bias Temperature Instability in Low-Temperature Polycrystalline Silicon Thin-Film Transistors

  • Author

    Chen, Chih-Yang ; Lee, Jam-Wem ; Wang, Shen-De ; Shieh, Ming-Shan ; Lee, Po-Hao ; Chen, Wei-Cheng ; Lin, Hsiao-Yi ; Yeh, Kuan-Lin ; Lei, Tan-Fu

  • Author_Institution
    Inst. of Electron., National Chiao-Tung Univ., Hsinchu
  • Volume
    53
  • Issue
    12
  • fYear
    2006
  • Firstpage
    2993
  • Lastpage
    3000
  • Abstract
    The authors have proved that negative bias temperature instability (NBTI) is an important reliability issue in low-temperature polycrystalline silicon thin-film transistors (LTPS TFTs). The measurements revealed that the threshold-voltage shift is highly correlated to the generation of grain-boundary trap states. Both these two physical quantities follow almost the same power law dependence on the stress time; that is, the same exponential dependence on the stress voltage and the reciprocal of the ambient temperature. In addition, the threshold-voltage shift is closely associated with the subthreshold-swing degradation, which originates from dangling bond formation. By expanding the model proposed for bulk-Si MOSFETs, a new model to explain the NBTI-degradation mechanism for LTPS TFTs is introduced
  • Keywords
    grain boundaries; semiconductor device reliability; silicon; thin film transistors; NBTI; grain boundary trap state; low temperature polycrystalline silicon; negative bias temperature instability; thin film transistor reliability; Bonding; Degradation; Negative bias temperature instability; Niobium compounds; Silicon; Stress; Temperature dependence; Thin film transistors; Titanium compounds; Voltage; Grain-boundary trap state; low-temperature polycrystalline silicon thin-film transistors (LTPS TFTs); negative bias temperature instability (NBTI); reliability;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2006.885543
  • Filename
    4016327