DocumentCode
839033
Title
Negative Bias Temperature Instability in Low-Temperature Polycrystalline Silicon Thin-Film Transistors
Author
Chen, Chih-Yang ; Lee, Jam-Wem ; Wang, Shen-De ; Shieh, Ming-Shan ; Lee, Po-Hao ; Chen, Wei-Cheng ; Lin, Hsiao-Yi ; Yeh, Kuan-Lin ; Lei, Tan-Fu
Author_Institution
Inst. of Electron., National Chiao-Tung Univ., Hsinchu
Volume
53
Issue
12
fYear
2006
Firstpage
2993
Lastpage
3000
Abstract
The authors have proved that negative bias temperature instability (NBTI) is an important reliability issue in low-temperature polycrystalline silicon thin-film transistors (LTPS TFTs). The measurements revealed that the threshold-voltage shift is highly correlated to the generation of grain-boundary trap states. Both these two physical quantities follow almost the same power law dependence on the stress time; that is, the same exponential dependence on the stress voltage and the reciprocal of the ambient temperature. In addition, the threshold-voltage shift is closely associated with the subthreshold-swing degradation, which originates from dangling bond formation. By expanding the model proposed for bulk-Si MOSFETs, a new model to explain the NBTI-degradation mechanism for LTPS TFTs is introduced
Keywords
grain boundaries; semiconductor device reliability; silicon; thin film transistors; NBTI; grain boundary trap state; low temperature polycrystalline silicon; negative bias temperature instability; thin film transistor reliability; Bonding; Degradation; Negative bias temperature instability; Niobium compounds; Silicon; Stress; Temperature dependence; Thin film transistors; Titanium compounds; Voltage; Grain-boundary trap state; low-temperature polycrystalline silicon thin-film transistors (LTPS TFTs); negative bias temperature instability (NBTI); reliability;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2006.885543
Filename
4016327
Link To Document