Title :
Normal zone initiation and propagation in Y-Ba-Cu-O coated conductors with Cu stabilizer
Author :
Wang, Xiaorong ; Caruso, Angelo R. ; Breschi, Marco ; Zhang, Guomin ; Trociewitz, Ulf P. ; Weijers, Hubertus W. ; Schwartz, Justin
Author_Institution :
Florida State Univ., Tallahassee, FL, USA
fDate :
6/1/2005 12:00:00 AM
Abstract :
In the ongoing effort to investigate the normal zone behavior of coated conductors, the effects of a localized, pulsed heat disturbance on a YBa2Cu3Ox/Ni-alloy conductor with Cu stabilizer was investigated. The sample was conduction cooled by a GM cryocooler in a vacuum environment, establishing nearly adiabatic conditions. A NiCr wire heater mounted on the sample was used to provide the heat pulse that initiated the normal zone. Consecutive voltage taps along the length of both sides of the sample monitored the propagation of the normal zone. Several thermocouples were glued on both sides of the sample to measure the temperature profile of the conductor. The minimum quench energies and normal zone propagation velocities were measured at ambient temperatures from 58 K to 79 K and transport current ranging from 30% to 90% of Ic. The voltage and temperature profiles are presented and discussed.
Keywords :
barium compounds; copper; high-temperature superconductors; nickel alloys; quenching (thermal); superconducting tapes; yttrium compounds; 58 to 79 K; Cu; Cu stabilizer; GM cryocooler; Ni-alloy conductor; NiCr; NiCr wire heater; YBa2Cu3O7; YBaCuO coated conductor; adiabatic condition; ambient temperature; heat pulse; minimum quench energy; normal zone initiation; normal zone propagation velocity; pulsed heat disturbance; temperature profile; thermocouple; transport current; vacuum environment; voltage profile; voltage taps; Conductors; Current measurement; Energy measurement; Laboratories; Nitrogen; Stability; Temperature measurement; Velocity measurement; Voltage; Yttrium barium copper oxide; Normal zone propagation; YBCO coated conductor; stability;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2005.847661