DocumentCode :
840732
Title :
Special issue on Compact Interconnect Models for Giga Scale Integration
Volume :
55
Issue :
9
fYear :
2008
Firstpage :
2532
Lastpage :
2532
Abstract :
Provides notice of upcoming special issue(s) of interest to practitioners and researchers.
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2008.929475
Filename :
4603178
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=840732