Title :
AC-Side CCM CS–CP–PFC Electronic Ballast
Author :
Lin, Ray-Lee ; Liu, Hung-Yi ; Shih, Hsu-Ming
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan
fDate :
5/1/2007 12:00:00 AM
Abstract :
This paper proposes a bridgeless-type ac-side continuous-conduction-mode (CCM) current-source (CS) charge-pump (CP) power-factor-correction (PFC) electronic ballast. The drawbacks of conventional dc-side discontinuous-conduction-mode (DCM) electronic ballasts include high di/dt, high current stress, and high switching losses. As a result, conventional dc-side DCM CS-CP-PFC electronic ballasts have low efficiency, due to the DCM operation, and the ballasts require a large input electromagnetic interference filter. Conventional dc-side CCM CS-CP-PFC electronic ballasts are able to solve these problems, but still require a higher component count. To efficiently reduce the cost of electronic components, a bridgeless-type ac-side CCM CS-CP-PFC electronic ballast is proposed. A 32-W rated power electronic ballast prototype circuit is designed and implemented. Experimental results verify that the input-current harmonics meet the IEC 61000-3-2 Class-C Standard, and the CP capacitor helps the PFC inductor current to achieve CCM and high power factor
Keywords :
IEC standards; electromagnetic interference; lamp accessories; network synthesis; power electronics; power factor correction; IEC 61000-3-2 class-C standard; ac-side CCM current-source charge-pump PFC electronic ballast; continuous-conduction mode; high current stress; high switching losses; inductor current; input electromagnetic interference filter; input-current harmonics; power factor correction; Charge pumps; Costs; Electromagnetic interference; Electronic ballasts; Electronic components; Filters; IEC standards; Power electronics; Stress; Switching loss; Charge-pump (CP); continuous-conduction-mode (CCM); current-source (CS); discontinuous-conduction-mode (DCM); electromagnetic interference (EMI); power-factor-correction (PFC);
Journal_Title :
Power Electronics, IEEE Transactions on
DOI :
10.1109/TPEL.2007.896449