Title :
YBCO thin film sputtering: an efficient way to promote microwave properties
Author :
Abbott, Fabrice ; Dégardin, Annick F. ; Kreisler, Alain J.
Author_Institution :
Lab. de Genie Electrique, Univ. Paris VI-XI, Gif-sur-Yvette, France
fDate :
6/1/2005 12:00:00 AM
Abstract :
To obtain high quality YBa2Cu3O7-δ (YBCO) films by on-axis rf-magnetron sputtering, we have undertaken a twofold study: first, we have investigated the role of sputtering plasma parameters (dc self-bias voltage, rf power, oxygen flux and water vapor flux introduced into the plasma) in order to limit resputtering effect. In particular, we have shown the significance of mastering the dc self-bias voltage. Secondly, we have deposited YBCO films on [001] LaAlO3 substrates taking into account the optimum flux conditions previously determined, and put into light the effect of the substrate temperature. Cross-optimization of the microstructural, electrical and microwave properties has been performed with respect to substrate temperature. A narrow optimal temperature window has been established to obtain films suitable for microwave applications.
Keywords :
barium compounds; high-frequency effects; sputter deposition; superconducting microwave devices; superconducting thin films; surface morphology; yttrium compounds; LaAlO3; YBCO thin film sputtering; YBa2Cu3O7-δ; cross-optimization; dc self-bias voltage; electrical properties; electrical transport properties; microstructural properties; microwave applications; microwave properties; microwave property; microwave surface resistance; on-axis rf-magnetron sputtering; optimal temperature window; optimum flux conditions; oxygen flux; resputtering effect; rf power; sputtering plasma parameters; substrate temperature; surface morphology; water vapor flux; Electric resistance; Plasma properties; Plasma temperature; Sputtering; Substrates; Surface morphology; Surface resistance; Surface topography; Voltage; Yttrium barium copper oxide; Electrical transport properties; YBCO thin films; microwave surface resistance; sputtering plasma; surface morphology;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2005.848630