DocumentCode :
841448
Title :
Non-bulk Si-O bonding at the Si-SiO2 interface
Author :
Boyd, I.W.
Author_Institution :
Dept. of Electron. & Electr. Eng., Univ. Coll. London
Volume :
24
Issue :
17
fYear :
1988
fDate :
8/18/1988 12:00:00 AM
Firstpage :
1062
Lastpage :
1063
Abstract :
A simple silicon dioxide bonding model is applied to a variety of films and shown to be applicable only for grown layers thicker than about 400 Å, indicating that `non-bulk´ bonding is present near to the silicon interface
Keywords :
bonds (chemical); elemental semiconductors; interface phenomena; semiconductor device models; semiconductor-insulator boundaries; silicon; silicon compounds; 400 A; Si-SiO2; bonding model; films; interface; nonbulk Si-O bonding; semiconductor-insulator boundaries;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
Filename :
191736
Link To Document :
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