DocumentCode
841697
Title
Demonstration of Direct Coupled Optical/Electrical Circuit Board
Author
Lim, Teck Guan ; Ramana, Pamidighantam V. ; Lee, Bryan Sik Pong ; Shioda, Tsuyoshi ; Kuruveettil, Haridas ; Li, Jing ; Suzuki, Kenji ; Fujita, Kazuhito ; Yamada, Kazuhiro ; Pinjala, Damaruganath ; Shing, John Lau Hon
Author_Institution
Inst. of Microelectron., Singapore
Volume
32
Issue
2
fYear
2009
fDate
5/1/2009 12:00:00 AM
Firstpage
509
Lastpage
516
Abstract
We report the development of a low cost, simple optical/electrical circuit board (OECB) using multimode polymer waveguide on FR4 printed circuit board (PCB). The design of this OECB uses only a 45deg-ended waveguide to couple and decouple the optical signal directly between the optical devices and the waveguide. The 45deg mirror is formed using excimer laser process on a multimode waveguide with temperature stability at reflow temperature. The optical waveguide is attached to a diced channel in the FR4 PCB using adhesive to form a completely planar circuit. This allows the laser diode and the photodiode to be assembled directly above the input and output of the waveguide using precision flip chip technology, which provides good alignment accuracy. This helps to increase the mechanical reliability of the circuit and minimize assembly requirements. Most importantly, all the electronic and optoelectronic devices used are commercially available components. In the paper, we report the details of the design, simulation result, and the testing results.
Keywords
electro-optical devices; flip-chip devices; mirrors; optical interconnections; optical waveguides; photodiodes; printed circuits; semiconductor lasers; FR4 printed circuit board; direct coupled optical-electrical circuit board; excimer laser process; flip chip technology; laser diode; mechanical reliability; multimode polymer waveguide; optical devices; optical interconnects; optical waveguide; optoelectronic devices; photodiode; planar circuit; reflow temperature; temperature stability; Optical interconnects; surface mount technology;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2009.2014246
Filename
4912376
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