Quantitative Characterization of True Leak Rate of Micro to Nanoliter Packages Using Helium Mass Spectrometer

Author

Goswami, Arindam ; Han, Bongtae ; Ham, S.-J. ; Jeong, B.-G.

Author_Institution

Dept. of Mech. Eng., University of Maryland, College Park, MD

Volume

32

Issue

2

fYear

2009

fDate

5/1/2009 12:00:00 AM

Firstpage

440

Lastpage

447

Abstract

We propose a method to quantify the true leak rate of micro to nano-liter packages using the helium mass spectrometer. A new concept called ldquopreprocessing timerdquo is introduced to take into account 1) the instability of the helium mass spectrometer during the initial part of its operation and 2) the contribution of viscous conduction to the total conduction. The proposed method utilizes the complete profile of the apparent leak rate measured by the mass spectrometer and determines the true leak rate by performing a nonlinear regression analysis. The method is implemented successfully to measure the true leak rate of micro-electro-mechanical system packages. The validity of the proposed scheme is corroborated experimentally.

Keywords

helium; hermetic seals; mass spectrometers; micromechanical devices; regression analysis; He; helium mass spectrometer; micro-electro-mechanical system packages; microliter packages; nanoliter packages; nonlinear regression analysis; preprocessing time; quantitative characterization; true leak rate; Fine leak test; helium mass spectrometer; hermeticity; true leak rate;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2009.2015002

Filename

4912379