Overview of packaging for the IBM Enterprise System/9000 based on the glass-ceramic copper/thin film thermal conduction module

Author

Tummala, Rao R. ; Ahmed, Shakil

Author_Institution

IBM Corp., Hopwell Junction, NY, USA

Volume

15

Issue

4

fYear

1992

fDate

8/1/1992 12:00:00 AM

Firstpage

426

Lastpage

431

Abstract

The ES/9000 models 820 and 900 high-performance mainframe processors have been significantly enhanced with respect to their predecessors, due to the following packaging advances: multilayer glass-ceramic/copper cofired substrate; multilayer polyimide/copper thin-film structure; discrete decoupling capacitors; buried engineering change conductors; enhanced pistons for very high thermal conduction cooling; and enhanced flip-chip solder connections. Some aspects of these advances are examined. The connectors and printed wiring board technologies used in this family of systems are summarized

Keywords

cooling; electric connectors; mainframes; multichip modules; packaging; printed circuit accessories; thin film circuits; ES 9000 model 820; ES 9000 model 900; IBM Enterprise System/9000; buried engineering change conductors; connectors; cooling pistons; discrete decoupling capacitors; flip-chip solder connections; high thermal conduction cooling; mainframe processors; multilayer glass-ceramic Cu substrate; multilayer polyimide Cu thin film structure; overview; packaging advances; printed wiring board technologies; thermal conduction module; Capacitors; Conductive films; Copper; Nonhomogeneous media; Packaging; Pistons; Polyimides; Substrates; Thermal conductivity; Transistors;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.159869

Filename

159869