Title :
Overview of packaging for the IBM Enterprise System/9000 based on the glass-ceramic copper/thin film thermal conduction module
Author :
Tummala, Rao R. ; Ahmed, Shakil
Author_Institution :
IBM Corp., Hopwell Junction, NY, USA
fDate :
8/1/1992 12:00:00 AM
Abstract :
The ES/9000 models 820 and 900 high-performance mainframe processors have been significantly enhanced with respect to their predecessors, due to the following packaging advances: multilayer glass-ceramic/copper cofired substrate; multilayer polyimide/copper thin-film structure; discrete decoupling capacitors; buried engineering change conductors; enhanced pistons for very high thermal conduction cooling; and enhanced flip-chip solder connections. Some aspects of these advances are examined. The connectors and printed wiring board technologies used in this family of systems are summarized
Keywords :
cooling; electric connectors; mainframes; multichip modules; packaging; printed circuit accessories; thin film circuits; ES 9000 model 820; ES 9000 model 900; IBM Enterprise System/9000; buried engineering change conductors; connectors; cooling pistons; discrete decoupling capacitors; flip-chip solder connections; high thermal conduction cooling; mainframe processors; multilayer glass-ceramic Cu substrate; multilayer polyimide Cu thin film structure; overview; packaging advances; printed wiring board technologies; thermal conduction module; Capacitors; Conductive films; Copper; Nonhomogeneous media; Packaging; Pistons; Polyimides; Substrates; Thermal conductivity; Transistors;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
