Device interconnection technology for advanced thermal conduction modules

The use of area array solder bumps on silicon devices known as controlled collapse chip connection (C4) balls for terminating logic and memory devices to ceramic substrates has been extended in both interconnection density and total number of chip I/O connections per module. In addition, a novel materials set, namely glass-ceramic with copper internal metallization along with thin film redistribution wiring on the top surface, has been introduced for multilayered ceramic substrates. Key elements of advanced glass-ceramic substrate technology relevant to flip-chip joining are reviewed. This is followed by a discussion of device join and replace processes used in advanced thermal conduction modules (ATCMs). These models have decoupling capacitors which are attached by C4 solder reflow. Optimization of the top surface metallurgy and device join parameters necessary to achieve reliable joining of more than 70,000 solder balls per module is discussed