Modeling and Test Verification for Hardened Integrated Circuits

Hardened dielectrically isolated integrated circuits are being developed to provide an order of magnitude improvement in radiation response over previous bipolar technology. This paper describes (a) the analytical and experimental techniques used to develop the hardened parts, and (b) comparative analytical and test results obtained thus far in the program. The paper describes how (a) various "element" models were defined for CAD usage, (b) how design tolerances were established for the element models, (c) how circuit design margins were established, (d) experimental techniques and equipment used to validate early designs, and (e) comparative analytical and test results.