• DocumentCode
    841912
  • Title

    The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules

  • Author

    Pan, Guang-Wen ; Prentice, Jeffrey A. ; Zahn, Sharon K. ; Staniszewski, Andrew J. ; Walters, Wayne L. ; Gilbert, Barry K.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Wisconsin Univ., Milwaukee, WI, USA
  • Volume
    15
  • Issue
    4
  • fYear
    1992
  • fDate
    8/1/1992 12:00:00 AM
  • Firstpage
    465
  • Lastpage
    477
  • Abstract
    The development of a comprehensive electromagnetic (EM) modeling tool, the Networking Algorithm, is discussed. This tool is capable of simulating on a digital computer the complexities inherent in real-world interconnects and packages, including simultaneous treatment of the effects of mixed types of transmission line interconnects (i.e. mixtures of stripline, microstrip, and coplanar lines), stubs and branches, reflections, and crosstalk between multiple nets. The type of modeling tool which has been developed is described, the mathematics of the Networking Algorithm is discussed, and a number of examples taken from a high-frequency digital package design are given to show how such a computer-based EM modeling tool set can assist in the design of high-performance packages
  • Keywords
    VLSI; circuit analysis computing; digital integrated circuits; electromagnetic compatibility; multichip modules; packaging; Networking Algorithm; branches; coplanar lines; crosstalk; electromagnetic modelling tool; high-density digital interconnects; high-frequency digital package design; high-performance packages; microstrip; mixed types of transmission line interconnects; multichip modules; real-world interconnects; reflections; single chip packages; stripline; stubs; Algorithm design and analysis; Computational modeling; Computer simulation; Coplanar transmission lines; Electromagnetic modeling; Mathematical model; Microstrip; Packaging; Reflection; Stripline;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.159875
  • Filename
    159875