Title :
The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules
Author :
Pan, Guang-Wen ; Prentice, Jeffrey A. ; Zahn, Sharon K. ; Staniszewski, Andrew J. ; Walters, Wayne L. ; Gilbert, Barry K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Milwaukee, WI, USA
fDate :
8/1/1992 12:00:00 AM
Abstract :
The development of a comprehensive electromagnetic (EM) modeling tool, the Networking Algorithm, is discussed. This tool is capable of simulating on a digital computer the complexities inherent in real-world interconnects and packages, including simultaneous treatment of the effects of mixed types of transmission line interconnects (i.e. mixtures of stripline, microstrip, and coplanar lines), stubs and branches, reflections, and crosstalk between multiple nets. The type of modeling tool which has been developed is described, the mathematics of the Networking Algorithm is discussed, and a number of examples taken from a high-frequency digital package design are given to show how such a computer-based EM modeling tool set can assist in the design of high-performance packages
Keywords :
VLSI; circuit analysis computing; digital integrated circuits; electromagnetic compatibility; multichip modules; packaging; Networking Algorithm; branches; coplanar lines; crosstalk; electromagnetic modelling tool; high-density digital interconnects; high-frequency digital package design; high-performance packages; microstrip; mixed types of transmission line interconnects; multichip modules; real-world interconnects; reflections; single chip packages; stripline; stubs; Algorithm design and analysis; Computational modeling; Computer simulation; Coplanar transmission lines; Electromagnetic modeling; Mathematical model; Microstrip; Packaging; Reflection; Stripline;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
