Title :
A new packaging technology using micro-solder bumps for high-speed photoreceivers
Author :
Tsunetsugu, Hideki ; Katsura, Kohsuke ; Hayashi, Tsuyoshi ; Ishitsuka, Fuminori ; Hata, Susumu
Author_Institution :
NTT Interdisciplinary Res. Labs., Tokyo, Japan
fDate :
8/1/1992 12:00:00 AM
Abstract :
A packaging technology for high-speed photoreceivers with a photodiode and a preamplifier is introduced. This technology features the following key interconnection technologies: micro-solder bumps, an impedance matched film carrier, and an optical fiber unit. Micro-solder bumps eliminate parasitic elements of the interconnection between the preamplifier and the package, and provides an impedance matched interconnection. The optical fiber unit with hemispherical-lensed fibers carries out high-efficiency optical coupling. The photoreceiver fabricated by applying these technologies achieves 3 dB bandwidth at over 20 GHz. This packaging technology should be effective for future high-speed optical transmission systems of over 10 Gbit/s
Keywords :
flip-chip devices; optical couplers; optical receivers; packaging; soldering; 10 Gbit/s; 20 GHz; bandwidth; flip chips; hemispherical-lensed fibers; high-speed optical transmission systems; high-speed photoreceivers; impedance matched film carrier; impedance matched interconnection; key interconnection technologies; micro-solder bumps; optical coupling; optical fiber unit; packaging technology; Bandwidth; High speed optical techniques; Impedance; Optical coupling; Optical fibers; Optical films; Optical interconnections; Packaging; Photodiodes; Preamplifiers;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
