Title :
Frequency-Division Bidirectional Communication Over Chip-to-Chip Channels
Author :
Bichan, Mike ; Hossain, Masum ; Carusone, Anthony Chan
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Toronto, Toronto, ON
fDate :
5/1/2009 12:00:00 AM
Abstract :
Frequency division multiple access is applied to bidirectional communication over chip-to-chip links. Frequency division is implemented by dividing the spectrum into low-frequency (dc) and high-frequency (ac) bands using a simple LC filter. The nonidealities that this filter introduces are compensated for with a transmitter/receiver pair that can recover signals in both bands. The receiver uses a dual-path topology that includes hysteresis to recover data from a signal with no dc content. The transmitter is a 6-tap (FIR) pre-emphasis equalizer with variable tap spacing. In simulation, the transmitter and receiver simultaneously communicate error-free at 8 Gb/s over the ac channel and at 500 Mb/s over the dc channel. Measurements shows that the ac and dc signals can be individually recovered and that the two signals occupy distinct frequency bands.
Keywords :
CMOS integrated circuits; frequency division multiple access; hysteresis; multichip modules; transceivers; CMOS integrated circuits; chip-to-chip channels; digital communication; frequency division multiaccess; frequency division multiple access; frequency-division bidirectional communication; hysteresis; multichip modules; pre-emphasis equalizer; pulse shaping circuits; transceivers; variable tap spacing; Complementary metal–oxide–semiconductor (CMOS) integrated circuits; digital communication; equalizers; frequency division multiaccess; hysteresis; microstrip; multichip modules; pulse shaping circuits; transceivers;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2009.2013454