• DocumentCode
    842499
  • Title

    Packing-based VLSI module placement using genetic algorithm with sequence-pair representation

  • Author

    Drakidis, A. ; Mack, R.J. ; Massara, R.E.

  • Author_Institution
    Dept. of Electron. Syst. Eng., Univ. of Essex, Colchester
  • Volume
    153
  • Issue
    6
  • fYear
    2006
  • Firstpage
    545
  • Lastpage
    551
  • Abstract
    The sequence-pair, a data structure with applications in packing-based VLSI module placement, has received significant amounts of research effort as the core of simulated annealing optimisers. Nevertheless, its application within genetic algorithm frameworks has not been adequately investigated. This paper presents a genetic algorithm approach to rectangle packing using the sequence-pair. The method is extended to handle symmetry constraints, a requirement often arising in the placement of analogue circuits. Genetic operators are developed taking into account the specific properties of the sequence-pair, and the algorithm is tested on several MCNC benchmarks
  • Keywords
    VLSI; circuit optimisation; genetic algorithms; integrated circuit layout; simulated annealing; VLSI module placement; data structure; genetic algorithm; rectangle packing; sequence-pair representation; simulated annealing; symmetry constraints;
  • fLanguage
    English
  • Journal_Title
    Circuits, Devices and Systems, IEE Proceedings -
  • Publisher
    iet
  • ISSN
    1350-2409
  • Type

    jour

  • Filename
    4020211