DocumentCode
842499
Title
Packing-based VLSI module placement using genetic algorithm with sequence-pair representation
Author
Drakidis, A. ; Mack, R.J. ; Massara, R.E.
Author_Institution
Dept. of Electron. Syst. Eng., Univ. of Essex, Colchester
Volume
153
Issue
6
fYear
2006
Firstpage
545
Lastpage
551
Abstract
The sequence-pair, a data structure with applications in packing-based VLSI module placement, has received significant amounts of research effort as the core of simulated annealing optimisers. Nevertheless, its application within genetic algorithm frameworks has not been adequately investigated. This paper presents a genetic algorithm approach to rectangle packing using the sequence-pair. The method is extended to handle symmetry constraints, a requirement often arising in the placement of analogue circuits. Genetic operators are developed taking into account the specific properties of the sequence-pair, and the algorithm is tested on several MCNC benchmarks
Keywords
VLSI; circuit optimisation; genetic algorithms; integrated circuit layout; simulated annealing; VLSI module placement; data structure; genetic algorithm; rectangle packing; sequence-pair representation; simulated annealing; symmetry constraints;
fLanguage
English
Journal_Title
Circuits, Devices and Systems, IEE Proceedings -
Publisher
iet
ISSN
1350-2409
Type
jour
Filename
4020211
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