DocumentCode :
842839
Title :
Effects of Cu stabilizer configuration on thermal stability of Nb3Sn composite superconductors under cryocooling condition
Author :
Watanabe, K. ; Mitsuhashi, Takaharu ; Nanato, N. ; Kim, S.B. ; Murase, Shigeyoshi ; Nishijima, Gen ; Watanabe, K. ; Miyoshi, Kenta
Author_Institution :
Dept. of Electr. & Electron. Eng., Okayama Univ., Japan
Volume :
15
Issue :
2
fYear :
2005
fDate :
6/1/2005 12:00:00 AM
Firstpage :
3410
Lastpage :
3413
Abstract :
It is known that current sharing effects of the stabilizer are limited in cryocooling conditions being different from poolboiling. Therefore we have studied stability under it, focusing on minimum quench energy (MQE) of Nb3Sn superconductors under various conditions of the applied magnetic field, temperature, and the transport current, for various volume fractions and configurations of Cu stabilizer. From the experimental results, the larger the external Cu volume fraction, the higher the MQE was obtained. All MQE data were summarized by only one line in characteristics of normalized MQE and normalized B(B/Bc2). The obtained MQE behavior was to be characterized by only one empirical equation. It is thought that the obtained formula is useful for a standard of designing the Nb3Sn superconductor and its coil under cryocooled condition.
Keywords :
composite superconductors; critical currents; high-temperature superconductors; low-temperature techniques; niobium alloys; superconducting tapes; thermal stability; tin alloys; type II superconductors; Cu stabilizer configuration; Nb3Sn; composite superconductors; cryocooling condition; current sharing effects; magnetic field; minimum quench energy; poolboiling; temperature; thermal stability; transport current; volume fractions; Cooling; Magnetic fields; Superconducting coils; Superconducting magnets; Superconductivity; Temperature; Thermal conductivity; Thermal stability; Tin; Wires; Cryocooling; MQE; thermal stability;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2005.848946
Filename :
1440404
Link To Document :
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