• DocumentCode
    842900
  • Title

    Extrusion of a hole for tin core insertion in the subelement billet for internal tin superconductor

  • Author

    Datta, S. ; Fu, X. ; McIntyre, P.M.

  • Author_Institution
    Coll. Station, Accel. Technol. Corp., College Station, TX, USA
  • Volume
    15
  • Issue
    2
  • fYear
    2005
  • fDate
    6/1/2005 12:00:00 AM
  • Firstpage
    3430
  • Lastpage
    3433
  • Abstract
    A process has been developed for extrusion of a hollow Nb/Cu subelement billet for internal-tin Nb3Sn superconductor. The development is part of a comprehensive strategy for cost reduction in fabrication of high-performance Nb3Sn wire. A hollow-core billet was extruded using a tapered-mandrel die so that the hollow core was preserved through the extrusion process. The extrusion went well, but a mistake in our preparation of the rods that filled the billet caused the resulting extrusion to be unusable for drawing. A small admixture of Cu-clad NbTi rods was interspersed among pure Nb rods in the billet stack. The initial cold drawing of the NbTi rods caused them to harden dramatically compared to the Nb rods. When the billet was extruded the NbTi rods did not reduce in dimension and instead arranged themselves end-on in the final extrusion. Notwithstanding this disappointment, the inner and outer Cu boundaries extruded without deformation and the center hole has a clean, smooth surface that would be suitable for insertion of a Sn core rod after pickling.
  • Keywords
    billets; cladding techniques; copper; extrusion; multifilamentary superconductors; niobium alloys; superconducting tapes; tin alloys; titanium alloys; type II superconductors; wire drawing; Cu; Cu boundary; Nb rods; Nb3Sn; Nb3Sn wire; NbTi; NbTi rods; cold drawing; deformation; extrusion process; internal tin superconductor; subelement billet; tapered-mandrel die; tin core insertion; Billets; Costs; Fabrication; Niobium compounds; Pickling; Superconducting filaments and wires; Superconducting films; Surface cleaning; Tin; Titanium compounds; Extrusion; internal tin; superconductor;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2005.849042
  • Filename
    1440409