Title :
Metal-Core Printed Circuit Board With Alumina Layer by Aerosol Deposition Process
Author :
Cho, Hyun Min ; Kim, Hyeong Joon
Author_Institution :
Electron. Mater. & Packaging Res. Center, Korea Electron. Technol. Inst., Seongnam
Abstract :
Heat dissipation properties of metal-core printed circuit boards (MCPCBs) having a ceramic dielectric layer are presented for high-power light-emitting diodes (LEDs). The proposed MCPCB is composed of a dense alumina thin film on an aluminum plate, instead of the conventional MCPCB with ceramic polymer composite, which shows low thermal conductivity. Dense alumina thin films, deposited by an aerosol deposition process, showed low leakage current and good dielectric breakdown for high-power applications. Thermal transient measurements of LEDs with the proposed MCPCB were compared to that of LEDs with conventional MCPCB. The MCPCBs proposed here showed better heat dissipation performance and lower thermal resistance.
Keywords :
aerosols; cooling; electric breakdown; leakage currents; light emitting diodes; polymer films; printed circuits; thermal resistance; thin films; transient analysis; aerosol deposition process; alumina layer; ceramic dielectric layer; ceramic polymer composite; dense alumina thin film; dielectric breakdown; heat dissipation properties; high-power light-emitting diodes; low leakage current; low thermal conductivity; lower thermal resistance; metal-core printed circuit board; thermal transient measurements; Aerosols; Aluminum; Ceramics; Dielectric thin films; Light emitting diodes; Polymer films; Printed circuits; Thermal conductivity; Thermal resistance; Thin film circuits; Aerosol deposition (AD); dielectric films; light-emitting diodes (LEDs); metal-core printed circuit board (MCPCB); thermal resistance;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2008.2001633
