DocumentCode
843471
Title
Anisotropic Etching of Silicon as a Tool for Creating Injection Molding Tooling Surfaces
Author
Werkmeister, Jaime ; Gosalvez, Miguel A. ; Willoughby, Patrick ; Slocum, Alexander H. ; Sato, Kazuo
Author_Institution
Precision Eng. Res. Group, MIT, Cambridge, MA
Volume
15
Issue
6
fYear
2006
Firstpage
1671
Lastpage
1680
Abstract
To improve the fidelity of the microinjection molding process, research is underway to implement silicon inserts as tooling surfaces in an injection molding machine. These tooling surfaces are created using typical microfabrication processes, such as bonding and chemical etching. The primary focus of this paper is the evaluation of anisotropic wet etching of off-axis silicon wafers, including experimental results and simulations. A method is presented for the determination of the lang110rang direction and subsequent alignment of the mask with an accuracy of 0.01deg. The use of atomistic kinetic Monte Carlo simulations reveals the extreme importance of proper alignment between the mask features and the off-axis wafer. As an example application, the fabrication steps and corresponding simulations of a silicon insert for the manufacture of disposable plastic razors are presented
Keywords
Monte Carlo methods; bonding processes; etching; injection moulding; micromachining; silicon; Si; anisotropic etching; anisotropic wet etching; atomistic kinetic Monte Carlo; atomistic simulation; bonding; chemical etching; injection molding tooling surfaces; microfabrication processes; microinjection molding process; micromolding; plastic razors; silicon wafers; wafer alignment; Anisotropic magnetoresistance; Chemical processes; Fabrication; Injection molding; Kinetic theory; Microinjection; Silicon; Virtual manufacturing; Wafer bonding; Wet etching; Anisotropic etching; atomistic simulation; micromolding; wafer alignment;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2006.885989
Filename
4020298
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