• DocumentCode
    843471
  • Title

    Anisotropic Etching of Silicon as a Tool for Creating Injection Molding Tooling Surfaces

  • Author

    Werkmeister, Jaime ; Gosalvez, Miguel A. ; Willoughby, Patrick ; Slocum, Alexander H. ; Sato, Kazuo

  • Author_Institution
    Precision Eng. Res. Group, MIT, Cambridge, MA
  • Volume
    15
  • Issue
    6
  • fYear
    2006
  • Firstpage
    1671
  • Lastpage
    1680
  • Abstract
    To improve the fidelity of the microinjection molding process, research is underway to implement silicon inserts as tooling surfaces in an injection molding machine. These tooling surfaces are created using typical microfabrication processes, such as bonding and chemical etching. The primary focus of this paper is the evaluation of anisotropic wet etching of off-axis silicon wafers, including experimental results and simulations. A method is presented for the determination of the lang110rang direction and subsequent alignment of the mask with an accuracy of 0.01deg. The use of atomistic kinetic Monte Carlo simulations reveals the extreme importance of proper alignment between the mask features and the off-axis wafer. As an example application, the fabrication steps and corresponding simulations of a silicon insert for the manufacture of disposable plastic razors are presented
  • Keywords
    Monte Carlo methods; bonding processes; etching; injection moulding; micromachining; silicon; Si; anisotropic etching; anisotropic wet etching; atomistic kinetic Monte Carlo; atomistic simulation; bonding; chemical etching; injection molding tooling surfaces; microfabrication processes; microinjection molding process; micromolding; plastic razors; silicon wafers; wafer alignment; Anisotropic magnetoresistance; Chemical processes; Fabrication; Injection molding; Kinetic theory; Microinjection; Silicon; Virtual manufacturing; Wafer bonding; Wet etching; Anisotropic etching; atomistic simulation; micromolding; wafer alignment;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2006.885989
  • Filename
    4020298