Title :
Polymer dielectrics for multichip module packaging
Author_Institution :
Dow Chemical Co., Charlotte, NC, USA
fDate :
12/1/1992 12:00:00 AM
Abstract :
The polymer dielectrics used to fabricate multichip modules are discussed. Numerous relevant properties of the dielectrics are compared and contrasted. It is shown that the suitability of a specific material is highly dependent on the process chosen to fabricate the structure and the intended application of the module. The material properties of the polymer dielectric must be taken into account when designing the fabrication process in order to exploit the advantages and control the disadvantages that all imperfect materials are bound to have
Keywords :
dielectric thin films; hybrid integrated circuits; multichip modules; polymer films; fabrication process; multichip module packaging; polymer dielectrics; Chemical technology; Dielectric thin films; Integrated circuit interconnections; Integrated circuit packaging; Multichip modules; Polymers; Semiconductor device packaging; Substrates; Very large scale integration; Wiring;
Journal_Title :
Proceedings of the IEEE
