Benchmark heat transfer data for microstructured surfaces for immersion-cooled microelectronics

Author

Nimkar, N.D. ; Bhavnani, S.H. ; Jaeger, R.C.

Author_Institution

Dept. of Mech. Eng., Auburn Univ., AL, USA

Volume

29

Issue

1

fYear

2006

fDate

3/1/2006 12:00:00 AM

Firstpage

89

Lastpage

97

Abstract

Pool boiling from a surface featuring micropyramidal reentrant cavities (mouth size 40 /spl mu/m) etched in silicon, bonded to a glass substrate, was studied. All experiments were conducted in the dielectric fluid FC-72 at 1 atm. The heat sink is designed to eliminate spreading through the substrate, and back heat loss. Experimentation showed that the critical heat flux was 12.8 W/cm/sup 2/. A high speed camera (400 frames/s) was used to record and quantify the effect of heat flux on departure diameter and bubble emission frequency. Both departure diameter and frequency showed an increasing trend with heat flux. Comparisons with existing literature are also presented.

Keywords

bubbles; cooling; dielectric liquids; glass; heat sinks; integrated circuit packaging; silicon; thermal management (packaging); 40 micron; FC-72 dielectric fluids; Si; bubble emission frequency; departure diameter; glass substrates; heat flux; heat sinks; heat transfer data; high speed camera; immersion cooling; immersion-cooled microelectronics; micropyramidal reentrant cavities; microstructured surfaces; pool boiling; thermal management; Bonding; Dielectric substrates; Etching; Frequency; Heat sinks; Heat transfer; Immersion cooling; Microelectronics; Mouth; Silicon; Bubble emission frequency; departure diameter; heat sinks; immersion cooling; pool boiling; reentrant cavities; thermal management of electronics;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2005.850536

Filename

1599497