• DocumentCode
    844859
  • Title

    Elastic modulus variation due to moisture absorption and permanent changes upon redrying in an epoxy based underfill

  • Author

    Ferguson, T.P. ; Jianmin Qu

  • Author_Institution
    Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    29
  • Issue
    1
  • fYear
    2006
  • fDate
    3/1/2006 12:00:00 AM
  • Firstpage
    105
  • Lastpage
    111
  • Abstract
    In this study, the influence of moisture on the elastic modulus of a no-flow underfill is characterized over a wide range of accelerated testing environments, and the permanent changes are evaluated upon fully redrying. Moisture saturation is reached in all environments prior to testing, thus the inherent wet modulus of the underfill is identified for each respective level of moisture preconditioning. The change in the elastic modulus as a function of moisture concentration is measured, as well as the reversible and irreversible effects from moisture uptake in the underfill upon redrying. Thermal aging from the temperature component of the accelerated testing environment is found to have no effect on the elastic modulus, while the moisture uptake is found to notably decrease the modulus at higher humidity levels. Recovery experiments demonstrate that most of the loss in the elastic modulus from moisture exposure is recoverable, although more irreversible damage did occur at higher humidity levels. Hydrolysis contributed to the irreversible loss in the modulus, while the reversible component is attributed to plasticization of the underfill from moisture uptake.
  • Keywords
    ageing; drying; elastic moduli; life testing; materials testing; moisture; plastic packaging; polymers; accelerated testing; elastic modulus variation; epoxy based underfill; epoxy resin; hydrolysis process; inherent wet modulus; moisture absorption; moisture concentration; moisture preconditioning; moisture saturation; moisture uptake effects; no-flow underfill; redrying process; thermal aging; underfill plasticization; Absorption; Assembly; Humidity; Life estimation; Mechanical factors; Microelectronics; Moisture; Packaging; Polymers; Temperature; Absorption; degradation; elastic modulus; epoxy resin; irreversible damage; moisture; recovery; temperature;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2005.853172
  • Filename
    1599499