Solder connections for high frequency applications between flexible and rigid printed circuit boards

Author

Siebert, W.P.

Author_Institution

Dept. of Inf. Technol. & Media, Mid Sweden Univ., Ostersund, Sweden

Volume

29

Issue

1

fYear

2006

fDate

3/1/2006 12:00:00 AM

Firstpage

118

Lastpage

126

Abstract

This article examines the backplane connector technology for high frequency use and presents a novel concept for shielded enclosures without air vents. The experimental soldering of connections between a flexible printed circuit (flex, for short) and a FR4-board as part of a backplane connector is presented. A very high contact density is reached by soldering vias on the flex to pads on the FR4; this soldering was performed both with ordinary Sn/Pb solder material and as well with lead-free solder alloy. The solder joints were examined using a scanning electron microscope (SEM) and the electrical properties of the flex/solder joint structure were measured.

Keywords

electric properties; electronics packaging; flexible electronics; lead alloys; printed circuits; scanning electron microscopes; soldering; solders; tin alloys; wiring; FR4-boards; SnPb; backplane connector technology; contact density; electrical properties; flexible printed circuit boards; lead-free solder alloy; rigid printed circuit boards; scanning electron microscope; solder connections; solder joints; solder material; soldering process; Backplanes; Connectors; Contacts; Environmentally friendly manufacturing techniques; Flexible printed circuits; Frequency; Scanning electron microscopy; Soldering; Tin; Vents; Backplane; FR4; connector; flex; high frequency; lead-free; soldering;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2005.853164

Filename

1599501