Title :
System Design Framework and Methodology for Xilinx Virtex FPGA Configuration Scrubbers
Author :
Herrera-Alzu, I. ; Lopez-Vallejo, Marisa
Author_Institution :
Dept. of Electron. Eng., Univ. Politec. de Madrid, Madrid, Spain
Abstract :
SRAM-based FPGAs, like Xilinx Virtex series, are susceptible to ionizing radiation and require configuration memory scrubbing in order to be used in harsh radiation environments. The scrubbing is typically performed by a scrubber device external to the FPGA (via configuration ports). A design framework and methodology for such scrubbers is described in this paper. The framework is based on SystemC modeling language and includes a Scrubber Model, a Supervisor Model, an FPGA Model and a Fault Injector Model. The framework allows simulating scrubbing algorithms and the configuration links at frame level or physical levels (SelectMAP or JTAG). The designer can define scrub and fault injection rates, frame and fault lists, fault detection methods, etc. With the proposed framework and methodology, the designer can explore the scrubber design space in advance to any hardware implementation.
Keywords :
SRAM chips; fault diagnosis; field programmable gate arrays; logic design; radiation effects; FPGA model; JTAG; SRAM-based FPGAs; SelectMAP; SystemC modeling language; Xilinx Virtex FPGA configuration scrubbers; Xilinx Virtex series; configuration links; configuration memory scrubbing; configuration ports; fault detection methods; fault injection rates; fault injector model; fault list; frame level; frame list; hardware implementation; harsh radiation environments; ionizing radiation; physical levels; scrubber design space; scrubber device; scrubber model; scrubbing algorithms; supervisor model; system design framework; Algorithm design and analysis; Circuit faults; Fault detection; Field programmable gate arrays; Integrated circuit modeling; Ports (Computers); Fault injection; Field Programmable Gate Array (FPGA); SystemC; modeling; scrubbing; simulation;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2013.2292816