• DocumentCode
    844968
  • Title

    Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids

  • Author

    Yi Li ; Kyoung-Sik Moon ; Wong, C.P.

  • Author_Institution
    Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    29
  • Issue
    1
  • fYear
    2006
  • fDate
    3/1/2006 12:00:00 AM
  • Firstpage
    173
  • Lastpage
    178
  • Abstract
    To improve the electrical properties of electrically conductive adhesives (ECAs), short-chain difunctional acids, such as malonic acid (acid M), adipic acid (acid A), and terephthalic acid (acid T) were introduced into a typical isotropic conductive adhesive formulation. By in-situ replacement of the commonly used surfactant-stearic acid in silver(Ag) flakes, such difunctional acids can increase the conductivity of ECAs. With the addition of malonic acid and adipic acid, which only have short chain single-bond hydrocarbon between the dicarboxylic groups, the conductivity of the typical conductive adhesives was improved significantly. Terephthalic acid, however, deteriorates the conductivity due to the rigid aromatic structure in the molecule. Dynamic mechanical analysis and thermomechanical study indicated the improved electrical properties with malonic and adipic acids were achieved without negatively affecting the mechanical and physical properties of ECAs.
  • Keywords
    adhesives; conducting polymers; electrical conductivity; silver; surfactants; thermomechanical treatment; adipic acid; aromatic structure; conductivity improvement; dicarboxylic groups; dynamic mechanical analysis; electrical conductive adhesives; electrical property improvement; in-situ replacement method; isotropic conductive adhesive formulation; malonic acid; short-chain difunctional acids; silver flakes; single-bond hydrocarbon; surfactant-stearic acid; terephthalic acid; thermomechanical analysis; Conductive adhesives; Conductivity; Electronics packaging; Environmentally friendly manufacturing techniques; Independent component analysis; Lead; Mechanical factors; Silver; Surface-mount technology; Tin; Conductivity improvement; dicarboxylic acid; electrically conductive adhesives (ECAs); in-situ replacement of silver flake surfactant;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2006.870388
  • Filename
    1599507