DocumentCode :
845034
Title :
Data retention characteristics of sub-100 nm NAND flash memory cells
Author :
Lee, Jae-Duk ; Choi, Jeong-Hyuk ; Park, Donggun ; Kim, Kinam
Author_Institution :
Res. & Dev. Center, Samsung Electron. Co., Gyunggi, South Korea
Volume :
24
Issue :
12
fYear :
2003
Firstpage :
748
Lastpage :
750
Abstract :
In contrast to the conventional theories, we have revealed that the most distinguished mechanism in the data retention phenomenon after Fowler-Nordheim (FN) stress in sub-100 nm NAND Flash memory cells is the annihilation of interface states. Interface state generation rate increases rapidly as the channel width of NAND flash cell decreases. Comparison of interface states and stress-induced leakage current (SILC) component during retention mode shows that the annihilation of interface states strongly affects data retention characteristics of the programmed cells.
Keywords :
CMOS memory circuits; NAND circuits; flash memories; interface states; leakage currents; tunnelling; Fowler-Nordheim stress; NAND flash memory cells; data retention characteristics; failure mechanism; interface states annihilation; interface trap; programmed cells; stress-induced leakage current; tunnel oxide degradation; Capacitors; Degradation; Dielectrics; Hot carriers; Hydrogen; Interface states; Leakage current; Research and development; Stress; Tungsten;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2003.820645
Filename :
1254606
Link To Document :
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