• DocumentCode
    847801
  • Title

    Scaling and strain dependence of nanoscale strained-Si p-MOSFET performance

  • Author

    Bufler, F.M. ; Fichtner, Wolfgang

  • Author_Institution
    Inst. fur Integrierte Syst., Eidgenossische Tech. Hochschule, Zurich, Switzerland
  • Volume
    50
  • Issue
    12
  • fYear
    2003
  • Firstpage
    2461
  • Lastpage
    2466
  • Abstract
    Self-consistent fullband Monte Carlo simulations based on nonlocal empirical pseudopotential band structures including spin-orbit splitting are employed to estimate the on-current in nanoscale strained-Si p-MOSFETs. Effective gate lengths from Leff = 75 nm down to Leff = 25 nm and strain levels corresponding to germanium contents of up to x = 0.4 in the relaxed Si1-xGex substrate are considered. It is found that the on-current continuously increases for growing substrate germanium contents. The strain-induced performance enhancement moderately decreases with scaling, but the improvement at Leff = 25 nm still attains 20% for x = 0.4. In contrast to strained-Si n-MOSFETs, increasing the substrate germanium content beyond x = 0.2 is essential for p-MOSFET performance improvement by strain in the sub 0.1 μm regime. However, even for x = 0.4 the on-current in a strained-Si p-MOSFET is still smaller than in a corresponding unstrained-Si n-MOSFET.
  • Keywords
    MOSFET; Monte Carlo methods; ballistic transport; elemental semiconductors; pseudopotential methods; semiconductor device models; silicon; spin-orbit interactions; MOSFET scaling; Si; effective gate lengths; nanoscale strained-Si p-MOSFET; nonlinear transport; nonlocal empirical pseudopotential; on-current; performance enhancement; quasi-ballistic transport; scaling dependence; self-consistent fullband Monte Carlo simulation; single-particle approach; spin-orbit splitting; strain dependence; velocity overshoot; CMOS technology; Capacitive sensors; Charge carrier processes; Current measurement; Germanium silicon alloys; MOSFET circuits; Monte Carlo methods; Silicon germanium; Silicon on insulator technology; Tensile stress;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2003.819655
  • Filename
    1255609