• DocumentCode
    847902
  • Title

    High breakdown voltage AlGaN-GaN power-HEMT design and high current density switching behavior

  • Author

    Saito, Wataru ; Takada, Yoshiharu ; Kuraguchi, Masahiko ; Tsuda, Kunio ; Omura, Ichiro ; Ogura, Tsuneo ; Ohashi, Hiromichi

  • Author_Institution
    Semicond. Co., Toshiba Corp., Kawasaki, Japan
  • Volume
    50
  • Issue
    12
  • fYear
    2003
  • Firstpage
    2528
  • Lastpage
    2531
  • Abstract
    AlGaN-GaN power high-electron mobility transistors (HEMTs) with 600-V breakdown voltage are fabricated and demonstrated as switching power devices for motor drive and power supply applications. The fabricated power HEMT realized the high breakdown voltage by optimized field plate technique and the low on-state resistance of 3.3 mΩcm2, which is 20 times lower than that or silicon MOSFETs, thanks to the high critical field of GaN material and the high mobility in 2DEG channel. The fabricated devices also demonstrated the high current density switching of 850 A/cm2 turn-off. These results show that AlGaN-GaN power-HEMTs are one of the most promising candidates for future switching power device for power electronics applications.
  • Keywords
    III-V semiconductors; aluminium compounds; current density; gallium compounds; power HEMT; power semiconductor switches; semiconductor device breakdown; wide band gap semiconductors; AlGaN-GaN; breakdown voltage; high breakdown voltage; high current density switching; high voltage device; low on-state resistance; optimized field plate technique; power electronics; power semiconductor device; power-HEMT design; switching power devices; Aluminum gallium nitride; Current density; Gallium nitride; HEMTs; MODFETs; MOSFETs; Motor drives; Power electronics; Power supplies; Silicon;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2003.819248
  • Filename
    1255618