Title :
High breakdown voltage AlGaN-GaN power-HEMT design and high current density switching behavior
Author :
Saito, Wataru ; Takada, Yoshiharu ; Kuraguchi, Masahiko ; Tsuda, Kunio ; Omura, Ichiro ; Ogura, Tsuneo ; Ohashi, Hiromichi
Author_Institution :
Semicond. Co., Toshiba Corp., Kawasaki, Japan
Abstract :
AlGaN-GaN power high-electron mobility transistors (HEMTs) with 600-V breakdown voltage are fabricated and demonstrated as switching power devices for motor drive and power supply applications. The fabricated power HEMT realized the high breakdown voltage by optimized field plate technique and the low on-state resistance of 3.3 mΩcm2, which is 20 times lower than that or silicon MOSFETs, thanks to the high critical field of GaN material and the high mobility in 2DEG channel. The fabricated devices also demonstrated the high current density switching of 850 A/cm2 turn-off. These results show that AlGaN-GaN power-HEMTs are one of the most promising candidates for future switching power device for power electronics applications.
Keywords :
III-V semiconductors; aluminium compounds; current density; gallium compounds; power HEMT; power semiconductor switches; semiconductor device breakdown; wide band gap semiconductors; AlGaN-GaN; breakdown voltage; high breakdown voltage; high current density switching; high voltage device; low on-state resistance; optimized field plate technique; power electronics; power semiconductor device; power-HEMT design; switching power devices; Aluminum gallium nitride; Current density; Gallium nitride; HEMTs; MODFETs; MOSFETs; Motor drives; Power electronics; Power supplies; Silicon;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2003.819248