DocumentCode
847902
Title
High breakdown voltage AlGaN-GaN power-HEMT design and high current density switching behavior
Author
Saito, Wataru ; Takada, Yoshiharu ; Kuraguchi, Masahiko ; Tsuda, Kunio ; Omura, Ichiro ; Ogura, Tsuneo ; Ohashi, Hiromichi
Author_Institution
Semicond. Co., Toshiba Corp., Kawasaki, Japan
Volume
50
Issue
12
fYear
2003
Firstpage
2528
Lastpage
2531
Abstract
AlGaN-GaN power high-electron mobility transistors (HEMTs) with 600-V breakdown voltage are fabricated and demonstrated as switching power devices for motor drive and power supply applications. The fabricated power HEMT realized the high breakdown voltage by optimized field plate technique and the low on-state resistance of 3.3 mΩcm2, which is 20 times lower than that or silicon MOSFETs, thanks to the high critical field of GaN material and the high mobility in 2DEG channel. The fabricated devices also demonstrated the high current density switching of 850 A/cm2 turn-off. These results show that AlGaN-GaN power-HEMTs are one of the most promising candidates for future switching power device for power electronics applications.
Keywords
III-V semiconductors; aluminium compounds; current density; gallium compounds; power HEMT; power semiconductor switches; semiconductor device breakdown; wide band gap semiconductors; AlGaN-GaN; breakdown voltage; high breakdown voltage; high current density switching; high voltage device; low on-state resistance; optimized field plate technique; power electronics; power semiconductor device; power-HEMT design; switching power devices; Aluminum gallium nitride; Current density; Gallium nitride; HEMTs; MODFETs; MOSFETs; Motor drives; Power electronics; Power supplies; Silicon;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2003.819248
Filename
1255618
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