DocumentCode :
848259
Title :
Chip Business Under Pressure
Author :
Dempsey, Paul
Volume :
4
Issue :
4
fYear :
2009
Firstpage :
17
Lastpage :
17
Abstract :
The paper discusses the International Solid State Circuits Conference of 2009 and gives a brief overview of its technical content.
Keywords :
semiconductor industry; ISSCC; International Solid State Circuits Conference; mobile consumer devices; semiconductor industry; top-of-the-range microprocessors;
fLanguage :
English
Journal_Title :
Engineering & Technology
Publisher :
iet
ISSN :
1750-9637
Type :
jour
Filename :
4913928
Link To Document :
بازگشت