DocumentCode
848259
Title
Chip Business Under Pressure
Author
Dempsey, Paul
Volume
4
Issue
4
fYear
2009
Firstpage
17
Lastpage
17
Abstract
The paper discusses the International Solid State Circuits Conference of 2009 and gives a brief overview of its technical content.
Keywords
semiconductor industry; ISSCC; International Solid State Circuits Conference; mobile consumer devices; semiconductor industry; top-of-the-range microprocessors;
fLanguage
English
Journal_Title
Engineering & Technology
Publisher
iet
ISSN
1750-9637
Type
jour
Filename
4913928
Link To Document