Title :
Development of brushless and sensorless vibration motor used for mobile phone
Author :
Chung, Shi-Uk ; Hwang, Gun-Yong ; Hwang, Sang-Moon ; Kang, Beom-Soo ; Kim, Han-gyoo
Author_Institution :
Sch. of Mech. Eng., Pusan Nat. Univ., South Korea
fDate :
9/1/2002 12:00:00 AM
Abstract :
With the wide use of mobile phones, a paging signal by a sound transducer acts as an environmental noise on many occasions, thus necessitating an alternative paging signal by a vibration motor. Conventional vibration motors employ three-phase windings with mechanical brushes for commutation, which is disadvantageous to manufacturing cost and productivity. In this paper, a new one-phase brushless and sensorless vibration motor is introduced utilizing digital signal processor chips in mobile phones. For electromagnetic field analysis, two-dimensional modeling can be implemented to determine the back electromotive force using axisymmetric boundary conditions. Geometric design parameters, such as coil pitch and magnet pitch. are considered for performance optimization. Through the experiments, it is shown that the proposed design has the equivalent performance with reduced number of parts, thus enhancing manufacturing productivity and reducing manufacturing cost.
Keywords :
brushless DC motors; cellular radio; electromagnetic fields; finite element analysis; permanent magnet motors; small electric machines; FEM; axial gap; axisymmetric boundary conditions; back electromotive force; brushless sensorless vibration motor; coil pitch; digital signal processor chips; electromagnetic field analysis; environmental noise; geometric design parameters; magnet pitch; manufacturing cost; manufacturing productivity; mobile phones; one-phase brushless motor; one-phase drive; performance optimization; permanent-magnet motor; sound transducer paging signal; two-dimensional modeling; Acoustic transducers; Brushes; Brushless motors; Commutation; Costs; Manufacturing; Mobile handsets; Productivity; Vibrations; Working environment noise;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2002.803187