DocumentCode
848644
Title
High-performance highly strained Ga/sub 0.23/In/sub 0.77/As/Al/sub 0.48/In/sub 0.52/As MODFET´s obtained by selective and shallow etch guide recess techniques
Author
Chough, K.B. ; Chang, T.Y. ; Feuer, Mark D. ; Sauer, N.J. ; Lalevic, B.
Author_Institution
AT&T Bell Labs., Holmdel, NJ, USA
Volume
13
Issue
9
fYear
1992
Firstpage
451
Lastpage
453
Abstract
Record high f/sub T/L/sub g/ products of 57 and 46 GHz- mu m have been achieved in Ga/sub 1-x/ In/sub x/As/AlInAs MODFETs with a strain compensated channel of x=0.77 and a lattice-matched channel of x=0.53, respectively. Although g/sub m/ as high as 950 mS/mm has been obtained by conventional deep recess for the gate, these latter devices show a prominent kink effect which lowers f/sub T/ and the voltage gain. By limiting the depth of final nonselective recess etch to 3 nm with the help of selective step etches, f/sub T/ as high as 47 GHz and g/sub m/ as high as 843 mS/mm have been achieved for MODFETs with x=0.77 and L/sub g/=1.1 mu m.<>
Keywords
III-V semiconductors; aluminium compounds; etching; gallium arsenide; high electron mobility transistors; indium compounds; solid-state microwave devices; 1.1 micron; 47 GHz; 843 mS; Ga/sub 0.23/In/sub 0.77/As-Al/sub 0.48/In/sub 0.52/As; MODFETs; kink effect; lattice-matched channel; selective step etches; shallow etch guide recess techniques; strain compensated channel; transconductance; unity current gain cutoff frequency; voltage gain; Capacitive sensors; Electron mobility; Epitaxial layers; Etching; FETs; Frequency; HEMTs; Indium phosphide; MODFETs; Voltage;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.192791
Filename
192791
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