Title :
Communication network issues and high-density interconnects in large-scale distributed computing systems
Author :
Tewksbury, Stuart K. ; Hornak, L.A.
Author_Institution :
AT&T Bell Labs., Holmdel, NJ, USA
fDate :
4/1/1988 12:00:00 AM
Abstract :
The authors discuss the impact of the physical interconnection environment through which the concurrent processes among locally distinct computing nodes of large-scale multicomputer systems are coupled. The communication capabilities implied for massively parallel computing systems by fine-grain task partitioning and by fine-grained communications are discussed in detail. Wafer-scale and hybrid wafer-scale system technologies which would support such communications are described
Keywords :
VLSI; computer networks; distributed processing; large-scale systems; parallel processing; telecommunication networks; communication networks; concurrent processes; fine-grain task partitioning; fine-grained communications; high-density interconnects; hybrid wafer-scale system technologies; large-scale distributed computing systems; locally distinct computing nodes; massively parallel computing systems; physical interconnection environment; Communication networks; Concurrent computing; Distributed computing; Fabrics; Intelligent networks; Large-scale systems; MOSFET circuits; Packaging; Parallel processing; Silicon;
Journal_Title :
Selected Areas in Communications, IEEE Journal on
