Communication network issues and high-density interconnects in large-scale distributed computing systems

Author

Tewksbury, Stuart K. ; Hornak, L.A.

Author_Institution

AT&T Bell Labs., Holmdel, NJ, USA

Volume

6

Issue

3

fYear

1988

fDate

4/1/1988 12:00:00 AM

Firstpage

587

Lastpage

609

Abstract

The authors discuss the impact of the physical interconnection environment through which the concurrent processes among locally distinct computing nodes of large-scale multicomputer systems are coupled. The communication capabilities implied for massively parallel computing systems by fine-grain task partitioning and by fine-grained communications are discussed in detail. Wafer-scale and hybrid wafer-scale system technologies which would support such communications are described

Keywords

VLSI; computer networks; distributed processing; large-scale systems; parallel processing; telecommunication networks; communication networks; concurrent processes; fine-grain task partitioning; fine-grained communications; high-density interconnects; hybrid wafer-scale system technologies; large-scale distributed computing systems; locally distinct computing nodes; massively parallel computing systems; physical interconnection environment; Communication networks; Concurrent computing; Distributed computing; Fabrics; Intelligent networks; Large-scale systems; MOSFET circuits; Packaging; Parallel processing; Silicon;

fLanguage

English

Journal_Title

Selected Areas in Communications, IEEE Journal on

Publisher

ieee

ISSN

0733-8716

Type

jour

DOI

10.1109/49.1928

Filename

1928