DocumentCode :
849038
Title :
BiCMOS technology with 60 GHz n-p-n bipolar and 0.25 mu m CMOS
Author :
Warnock, James ; Shahidi, Ghavam G. ; Dasvari, B. ; Wu, Benjamin ; Taur, Yuan ; Wong, C. ; Jenkins, K. ; Chen, Chih-Liang
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown heights, NY, USA
Volume :
13
Issue :
11
fYear :
1992
Firstpage :
578
Lastpage :
580
Abstract :
A BiCMOS technology has been developed that integrates a high-performance self-aligned double-polysilicon bipolar device into an advanced 0.25 mu m CMOS process. The process sequence has been tailored to allow maximum flexibility in the bipolar device design without perturbation of the CMOS device parameters. Thus, n-p-n cutoff frequencies as high as 60 GHz were achieved while maintaining a CMOS ring oscillator delay per stage of about 54 ps at 2.5 V supply comparable to the performance in the CMOs-only technology. BiCMOS and BiNMOS circuits were also fabricated. BiNMOS circuits exhibited approximately=45% delay improvement compared to CMOS-only circuits under high load conditions at 2.5 V.<>
Keywords :
BiCMOS integrated circuits; delays; integrated circuit technology; 0.25 micron; 54 ps; 60 GHz; BiCMOS technology; BiNMOS circuits; CMOS device parameters; CMOS ring oscillator delay; bipolar device design; delay improvement; high load conditions; n-p-n cutoff frequencies; self-aligned double-polysilicon bipolar device; BiCMOS integrated circuits; CMOS process; CMOS technology; Cutoff frequency; Delay; Dielectrics; Implants; Metallization; Passivation; Rapid thermal annealing;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.192841
Filename :
192841
Link To Document :
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