Title :
Production Planning and WIP Assignment for Wafer Fabrication Tools With Availability Constraints
Author :
Perlman, Yael ; Crispil, Elad ; Kalir, Adar
Author_Institution :
Dept. of Manage., Bar-Ilan Univ., Ramat Gan, Israel
Abstract :
This paper deals with a short-term production plan of a single toolset during a shift at a semiconductor fabrication plant. We propose a cost-based optimization model that seeks to minimize the cost of the shift while meeting the following conditions: 1) the shift produces its required output, measured in work-in-process (WIP) levels; 2) preventive maintenance (PM) tasks are carried out in compliance with the manufacturer´s recommended PM policy; and 3) the equipment undergoes cleaning operations, as recommended by the manufacturer, in a way that minimizes the production of blank wafers (a by-product of the cleaning process). A linear programming model is formulated and a practical procedure is provided to solve this production plan problem. Data from a real fab are used to demonstrate the optimality and applicability of the proposed approach. Results of various sensitivity analyzes further demonstrate how the model can be used to analyze the impact of changes in cost parameters, WIP levels and production rate parameters on the optimal solution.
Keywords :
costing; linear programming; maintenance engineering; production planning; semiconductor device manufacture; work in progress; PM policy; WIP assignment; availability constraints; blank wafers; cost parameters; cost-based optimization model; linear programming model; preventive maintenance; production planning; production rate parameters; semiconductor fabrication plant; short-term production plan; wafer fabrication tools; work-in-process levels; Cleaning; Fabrication; Job shop scheduling; Planning; Production planning; Semiconductor device modeling; Production planning; Semiconductor manufacturing; Semiconductor manufacturing;; WIP management;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2015.2439951