DocumentCode
84924
Title
Thermal-Aware On-Line Scheduler for 3-D Many-Core Processor Throughput Optimization
Author
Yu, Cody Hao ; Chiao-Ling Lung ; Yi-Lun Ho ; Ruei-Siang Hsu ; Ding-Ming Kwai ; Shih-Chieh Chang
Author_Institution
Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
33
Issue
5
fYear
2014
fDate
May-14
Firstpage
763
Lastpage
773
Abstract
3-D many-core processor (3-D MCP) has become an emerging technology to tackle the power wall problem due to rapidly increasing number of transistors. However, when maximizing the throughput of 3-D MCP, which is expressed as a weighted sum of the speeds, due to the inherent heat removal limitation, thermal issues must be taken into consideration. Since the temperature of a core strongly depends on its location in the 3-D IC, a proper task allocation can alleviate the thermal problem and improve the throughput. Nevertheless, conventional techniques require computationally intensive thermal simulation, which prohibits its usage from the online application. In this paper, we propose an efficient online task allocation and task migration algorithm attempting to maximize the throughput of 3-D MCP simultaneously, considering unfinished tasks left from the last scheduling interval and new incoming tasks of this scheduling interval. The results of our experiments show that our proposed method achieves a 20.82X runtime speedup. These results are comparable to the exhaustive solutions obtained from optimization-modeling software LINGO. In addition, on average, our throughput results, with and without consideration of unfinished tasks, are only 4.39% and 0.69% worse, respectively, than that of the exhaustive method. In 128 task-to-core allocations, our method takes only 0.951 ms, which is 59.39 times faster than that of the previous work.
Keywords
microprocessor chips; three-dimensional integrated circuits; 3D IC; 3D many-core processor throughput optimization; MCP; computationally intensive thermal simulation; exhaustive method; online task allocation; optimization-modeling software LINGO; scheduling interval; task migration algorithm; task-to-core allocations; thermal-aware online scheduler; time 0.951 ms; Computational modeling; Heating; Optimization; Resource management; Throughput; Transient analysis; Vectors; 3-D integration; many-core processor; migration penalty; task allocation; task migration; temperature uniformity; thermal aware; throughput optimization;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2013.2293476
Filename
6800164
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