DocumentCode :
849315
Title :
Degradation of junction leakage in devices subjected to gate oxidation in nitrous oxide (MOS transistors)
Author :
Mathews, Viju K. ; Maddox, Roy L. ; Fazan, Pierre C. ; Rosato, John ; Hwang, Hyunsang ; Lee, Jack
Author_Institution :
Micron Semiconductor Inc., Boise, ID, USA
Volume :
13
Issue :
12
fYear :
1992
Firstpage :
648
Lastpage :
650
Abstract :
Nitrided gate oxides offer several electrical and reliability advantages over conventional oxides and also provide a good barrier against impurity diffusion. Oxidation in nitrous oxide (N/sub 2/O) has been very successful in overcoming some of the problems associated with nitridation in ammonia. The authors have observed that the extent of N/sub 2/O oxidation has a strong detrimental effect on the drain leakage current of MOS transistors in the off state. This phenomenon has been identified to be caused by an increase in the active area junction leakage current.<>
Keywords :
carrier lifetime; insulated gate field effect transistors; leakage currents; oxidation; semiconductor device testing; C-V testing; MOS transistors; N/sub 2/O oxidation; active area junction leakage current; drain leakage current; gate oxidation; impurity diffusion; junction leakage; minority carrier diffusion length; off state; reliability advantages; Annealing; Current measurement; Degradation; Diodes; Implants; Impurities; Leakage current; Lifting equipment; MOSFET circuits; Oxidation;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.192873
Filename :
192873
Link To Document :
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