• DocumentCode
    849334
  • Title

    Gate and drain currents in off-state buried-type p-channel LDD MOSFETs

  • Author

    Chen, Ming-Jer ; Chao, Kum-Chang ; Huang, Tzuen-Hsi ; Tsaur, Jyh-Min

  • Author_Institution
    Inst. of Electron., Nat. Chaio-Tung Univ., Hsin-chu, Taiwan
  • Volume
    13
  • Issue
    12
  • fYear
    1992
  • Firstpage
    654
  • Lastpage
    657
  • Abstract
    The buried-type p-channel LDD MOSFETs biased at high positive gate voltage exhibit novel characteristics: (1) the ratio of the drain to gate currents is about 1*10/sup -3/ to 5*10/sup -3/; and (2) the gate and drain currents both are functions of only the gate voltage minus the n-well bias. Such characteristics are addressed based on the formation of the surface n/sup +/ inversion layer due to the punchthrough of the buried channel to the underlying shallow p-n junction. The measured gate current is due to the Fowler-Nordheim tunneling of electrons from this inversion layer surface and the holes generated within the high-field oxide constitute the drain current. The n/sup +/ inversion layer surface potential is found to be equal to the n-well bias plus 0.55 V. As a result, both the oxide field and the gate and drain currents are independent of drain voltage.<>
  • Keywords
    insulated gate field effect transistors; inversion layers; semiconductor device testing; surface potential; tunnelling; Fowler-Nordheim tunneling; buried channel punchthrough; buried-type p-channel LDD MOSFETs; drain currents; gate currents; gate voltage; high-field oxide; oxide field; shallow p-n junction; surface n/sup +/ inversion layer; surface potential; Chaos; Charge carrier processes; Councils; Current measurement; MOSFETs; P-n junctions; Semiconductor device manufacture; Semiconductor diodes; Tunneling; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.192875
  • Filename
    192875