DocumentCode
850725
Title
O/sup 2/ABA: a novel high-performance predictable circuit architecture for the deep submicron era
Author
Im, Yonghee ; Roy, Kaushik
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume
10
Issue
3
fYear
2002
fDate
6/1/2002 12:00:00 AM
Firstpage
221
Lastpage
229
Abstract
Current VLSI design techniques focus on four major goals: higher integration, faster speed, lower power, and shorter time-to-market. These goals have been accomplished mainly by deep submicron (DSM) technology along with voltage scaling. However, scaling down of feature size causes larger interwire capacitance which results in large crosstalk between interconnects. In this paper, we propose a novel predictable circuit architecture, named "optimized overlaying array-based architecture" (O/sup 2/ABA), especially suited for the deep submicron regime. O/sup 2/ABA achieves reduction in crosstalk by considering the current directions and by reducing interwire capacitance. The introduction of "unit cell" leads to regularity, which makes the performance predictable even before layout, and shortens design time. O/sup 2/ABA is compared with other design styles, such as custom design and standard cell approach, in terms of coupling capacitance, area, and delay.
Keywords
CMOS logic circuits; VLSI; adders; circuit layout CAD; crosstalk; integrated circuit layout; logic CAD; multiplying circuits; Miller coefficient factor; O/sup 2/ABA circuit architecture; VLSI design; crosstalk reduction; current directions; custom design; deep submicron; delay fault; dynamic circuit; dynamic logic; dynamic noise margin; four-bit full-adder circuit; high-performance predictable circuit architecture; interwire capacitance; moment matching technique; optimized overlaying array-based architecture; ripple-carry multiplier; scaled CMOS technologies; signal integrity; standard cell; unit cell; Capacitance; Circuit noise; Coupling circuits; Crosstalk; Delay; Integrated circuit interconnections; Logic; Time to market; Very large scale integration; Wiring;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2002.1043325
Filename
1043325
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