• DocumentCode
    850797
  • Title

    Simulation and modeling of the effect of substrate conductivity on coupling inductance and circuit crosstalk

  • Author

    Massoud, Yehia ; White, Jacob

  • Author_Institution
    Synopsys Inc., Mountain View, CA, USA
  • Volume
    10
  • Issue
    3
  • fYear
    2002
  • fDate
    6/1/2002 12:00:00 AM
  • Firstpage
    286
  • Lastpage
    291
  • Abstract
    The goal of this work was to simulate the effect of the finite conductivity of semiconductor substrates on the on-chip coupling inductance and then to investigate the effect of the on-chip coupling inductance on circuit crosstalk. In addition, the limitations of standard approaches for estimating coupling inductance are examined. A method for the reduction of the coupling inductance and its effect on circuit crosstalk is also discussed.
  • Keywords
    circuit simulation; crosstalk; earthing; electromagnetic coupling; finite volume methods; inductance; iterative methods; mesh generation; FastHenry program; circuit crosstalk; coupling inductance reduction; discretized equation; fast multipole algorithm; finite conductivity effect; ideal ground-plane assumption; magnetoquasistatic coupling; mesh formulation; modeling; on-chip coupling inductance; semiconductor substrates; simulation; two-loop model; Circuit simulation; Conductivity; Conductors; Coupling circuits; Crosstalk; Frequency; Inductance; Integrated circuit interconnections; Predictive models; Substrates;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2002.1043331
  • Filename
    1043331