DocumentCode :
851291
Title :
Reduced gate leakage current in AlGaN/GaN HEMT by oxygen passivation of AlGaN surface
Author :
Hong, Sun K. ; Shim, K.H. ; Yang, J.W.
Author_Institution :
Dept. of Semicond. Sci. & Technol./Semicond. Phys. Res. Center, Chonbuk Nat. Univ., Chonju
Volume :
44
Issue :
18
fYear :
2008
Firstpage :
1091
Lastpage :
1092
Abstract :
A remarkable reduction of the gate leakage current for AlGaN/GaN high electron mobility transistors (HEMT) is reported. The oxygen plasma treatment of the fabricated HEMT at 200degC reduced the gate leakage current by four orders of magnitude without degrading the transconductance and the drain current characteristics of the HEMT. X-ray photoelectron spectroscopy analysis showed that the binding of oxygen at the AlGaN surface is related to the reduction in the leakage current.
Keywords :
III-V semiconductors; X-ray photoelectron spectra; aluminium compounds; gallium compounds; high electron mobility transistors; leakage currents; passivation; plasma materials processing; wide band gap semiconductors; AlGaN-GaN; HEMT; X-ray photoelectron spectroscopy; drain current characteristics; gate leakage current; high electron mobility transistors; oxygen passivation; oxygen plasma treatment; temperature 200 degC; transconductance;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:20081350
Filename :
4610689
Link To Document :
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