• DocumentCode
    852933
  • Title

    Some Aspects of the Thermal Design of Electronic Equipment Operating at 300-500°C Environmental Temperature

  • Author

    Welsh, James P.

  • Author_Institution
    Cornell Aeronautical Lab., Inc., Buffalo, N. Y.
  • Issue
    4
  • fYear
    1958
  • Firstpage
    220
  • Lastpage
    224
  • Abstract
    Aspects of electronic part-cooling techniques applicable to 300-500°C equipments are presented. Contrary to some beliefs, the minimization of thermal resistance at these temperatures is as important as at lower temperatures. The significant shifts in the natural modes of heat transfer which occur with high-temperature electronic parts are outlined, together with some recommended methods of cooling high-temperature parts and assemblies.
  • Keywords
    Assembly; Degradation; Electronic equipment; Electronics cooling; Heat transfer; Helium; Navigation; Temperature; Thermal force; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Aeronautical and Navigational Electronics, IRE Transactions on
  • Publisher
    ieee
  • ISSN
    0096-1639
  • Type

    jour

  • DOI
    10.1109/TANE3.1958.4201633
  • Filename
    4201633