DocumentCode
852933
Title
Some Aspects of the Thermal Design of Electronic Equipment Operating at 300-500°C Environmental Temperature
Author
Welsh, James P.
Author_Institution
Cornell Aeronautical Lab., Inc., Buffalo, N. Y.
Issue
4
fYear
1958
Firstpage
220
Lastpage
224
Abstract
Aspects of electronic part-cooling techniques applicable to 300-500°C equipments are presented. Contrary to some beliefs, the minimization of thermal resistance at these temperatures is as important as at lower temperatures. The significant shifts in the natural modes of heat transfer which occur with high-temperature electronic parts are outlined, together with some recommended methods of cooling high-temperature parts and assemblies.
Keywords
Assembly; Degradation; Electronic equipment; Electronics cooling; Heat transfer; Helium; Navigation; Temperature; Thermal force; Thermal resistance;
fLanguage
English
Journal_Title
Aeronautical and Navigational Electronics, IRE Transactions on
Publisher
ieee
ISSN
0096-1639
Type
jour
DOI
10.1109/TANE3.1958.4201633
Filename
4201633
Link To Document