DocumentCode :
853150
Title :
Impact of Design on High-Frequency Performance of Advanced MIM Capacitors Using Si _{3} N _{4} Die
Author :
Piquet, Jérome ; Bermond, éCdric ; Thomas, Maryline ; Farcy, Alexis ; Lacrevaz, Thierry ; Blampey, Benjamin ; Torres, Joaquin ; Fléchet, Bernard ; Angénieux, Gilbert
Author_Institution :
LAHC, Univ. de Savoie, Le Bourget du Lac
Volume :
31
Issue :
3
fYear :
2008
Firstpage :
546
Lastpage :
551
Abstract :
High-frequency characterizations of ultra thin 32 nm PECVD Si3N4 dielectric in an advanced metal-insulator-metal (MIM) capacitors are presented, with focus on the impact of design on the performance of MIM capacitors. Frequency dependent capacitance has been extracted over a wide range of frequency bandwidth. An equivalent model circuit of capacitors including four parameters was developed to explain this behavior. The results have been compared with the values obtained from a 3-D electromagnetic modeling. A specific chart has been introduced to predict the electrical performance of new MIM capacitor designs.
Keywords :
MIM devices; copper; dielectric thin films; equivalent circuits; plasma CVD coatings; silicon compounds; tantalum compounds; thin film capacitors; 3-D electromagnetic modeling; Cu-Si3N4-TaN-Cu; MIM capacitors; capacitor designs; dielectric layers; equivalent model circuit; frequency dependent capacitance; high-frequency performance; metal-insulator-metal capacitors; size 32 nm; ultra thin PECVD dielectric; High-frequency measurement; SiN dielectric; merit factor; metal–insulator–metal (MIM) capacitor; quality factor; thru reflect line (TRL); vector network analyzer (VNA);
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2008.2001128
Filename :
4618398
Link To Document :
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