Title :
Electronic packaging techniques for surveyor lunar spacecraft
Author :
Hawley, A.E. ; Klein, E.A. ; Lenhart, D.D. ; Shrum, L.R.
Author_Institution :
Hughes Aircraft Co., Culver City, Calif.
fDate :
3/1/1963 12:00:00 AM
Abstract :
Summary form only. An abstract of the above-titled article, taken from the 1963 IEEE International Convention (held March 25-28, New York, NY, USA), is presented.
Keywords :
Circuits; Connectors; Electronics packaging; History; Moon; Refrigeration; Space vehicles; Thermal force; Thermoelectricity; Welding;
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/PROC.1963.2185
