• DocumentCode
    853406
  • Title

    Case histories in the field of microelectronic packaging

  • Author

    Lazar, Mircea

  • Author_Institution
    Burndy Corp., Norwalk, Conn.
  • Volume
    51
  • Issue
    3
  • fYear
    1963
  • fDate
    3/1/1963 12:00:00 AM
  • Firstpage
    537
  • Lastpage
    537
  • Abstract
    Summary form only. An abstract of the above-titled article, taken from the 1963 IEEE International Convention (held March 25-28, New York, NY, USA), is presented.
  • Keywords
    Aerospace electronics; Electronics cooling; Electronics packaging; History; Microelectronics; Refrigeration; Thermal force; Thermal loading; Thermoelectricity; Welding;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/PROC.1963.2186
  • Filename
    1444116
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=853406